We report on a method to fabricate complex microelectromechanical systems (MEMS) structures onto a flexible membrane. Three-dimensional and high-aspect-ratio MEMS structures were formed on a silicon-on-insulator wafer by deep reactive-ion etching and then were partially buried in a flexible polymer membrane. After being released from the silicon substrate, the flexible membrane with the complex structures could deform to curvilinear shapes and then could be transferred onto curvilinear surfaces. The effect of the structure and density of the pillars on the transferring procedure is studied. Potentially, this method could be utilized to transfer any MEMS structures and devices to any nonplanar surfaces, thus possessing great potential in MEMS devices.